Sales Manager: Mr. Peng
Tel: +86 136 0112 5769
E-mail:sales@technol.cn
Feature: Equipped with circular magnetron sputtering target, rectangular magnetron sputtering target, multi-arc target, magnetic filter arc source, etc. Combined with magnetron, ion plating and other various functions, suitable for the universities and scientific research units with multiple coating requirements.
Main Function:
* The equipment can be used to prepare single and multi-layer metal
film, dielectric film, semiconductor film, sensor film, heat-resistant
alloy film, hard film, corrosion-resistant film, etc.;
* Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium nitride, titanium carbide, titanium
nitride, chromium nitride, titanium oxide, alumina, ITO, etc.;
* Applications: tool, mold, electronic accessories, metal shell, ceramic substrate, etc..
Application: Widely used in colleges & universities, research institutes and enterprises of device R & D and manufacturing and small batch production.
Technical Parameters
| Equipment Name | Magnetron & Ion Sputtering Combination System |
| Model | TSU650 |
| Chamber Structure | Vertical cylindrical front door structure, double-layer water cooling |
| Chamber Size | Φ650×H650mm |
| Rotating Workpiece Rack | Φ350×H400mm, 4~6 workstations revolution/rotation workpiece rest |
Workpiece Rack Baking Temperature | Room temperature~500±5℃(932±41℉), adjustable and controllable (PID control temperature） |
| Workpiece Rack Movement | 0-5RPM adjustable |
| Auxiliary ion source | Bias voltage, auxiliary linear ion source(optional) |
| Cathode | Rectangular magnetron target, plane arc source, magnetic filter arc source, circular flat target(optional) |
| Control Method | PLC Control/IPC automatic control(optional) |
| Occupied Area | (Mainframe) L2780×W1200×H2020mm |
| Power | ≥70kW |
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